TimeWalker® is a next-generation Er:YAG and Nd:YAG aesthetic laser dedicated to facial aesthetic treatments. With a unique combination of Fotona’s advanced laser technology and proprietary ASP-powered treatment modes, TimeWalker® is designed and optimized for non-invasive facelifting procedures such as Fotona4D®, SmoothEye® and LipLase™.
Safe and Highly Effective Er:YAG
TimeWalker® is equipped with an advanced, high-performance Er:YAG laser featuring micron-thermal regeneration for non-ablative treatments as well as precise ablation control.
Unique, Patented Fotona SMOOTH® Technology
Patented Fotona SMOOTH® Er:YAG laser pulses activate a unique form of non-ablative thermal stimulation with a gentle dual-tissue regeneration process to achieve highly controlled and safe collagen tightening and new collagen formation within the tissue. Patients will observe an immediate tightness and freshness as well as a prolonged rejuvenation effect, making it ideal for maintenance treatments as well.
With additional functions ranging from cold minimally ablative to hot deep ablative peels, and from full-field to fractional resurfacing, treatments can be tailored to any specific skin condition to achieve exceptional results.
Gold-Standard Nd:YAG with Patented PIANO® and FRAC3® Pulse Technology
The Nd:YAG laser included with TimeWalker® perfectly complements the Er:YAG laser’s ablative action with the ability to penetrate deeply into the skin to create thermal effects without damaging the skin surface.
TimeWalker’s next-generation, super-extended PIANO® mode provides full-thickness bulk heating for safe and controlled tightening of the dermis and epidermis, while sparing the skin from unnecessary thermal damage.
And Fotona’s revolutionary FRAC3® technology produces a three-dimensional fractional pattern in the epidermis and dermis, selectively targeting specific tissue chromophores for treatment of deeper, age-related skin imperfections, initiating neocollagenesis and healing without damaging the epidermis, regardless of skin type.
